TSMC Begins Pilot Production of 3nm Chips: Report

Taiwan Semiconductor Manufacturing Co. has started risk production of chips using its N3 (3 nm-class) fabrication process, two reports from Taiwan read. As usual, it will take the contract maker of chips and its partners several quarters to polish off the technology and designs before both enter high-volume manufacturing (HVM). 

TSMC initiated pilot production of N3 chips at its Fab 18 at the Southern Taiwan Science Park near Tainan, according to reports from DigiTimes and TechTaiwan. HVM of chips using the new node will commence in the second half of the year, but since cycle time for the new process is over 100 days, the first N3 chips made by TSMC will ship in early 2023.